1. Core performance

       Melting point: 3422℃, high temperature resistance, creep resistance, no deformation at high temperatures

       High density of 19.25 g/cm³, excellent radiation shielding performance

       Low thermal expansion coefficient, excellent dimensional stability

       High hardness, wear resistance, corrosion resistance, and stable performance in vacuum environment

       It exhibits high brittleness at room temperature and requires precision machining

       II. Common materials

       Pure tungsten plate

       High temperature resistance and high purity, used for high temperature furnaces, thermal fields, and electronic devices

       Tungsten-rhenium plate

       It has better toughness and stronger high-temperature resistance, and is used for high-temperature structural components

       High-density tungsten alloy plate

       Easy to process, good shielding

       Tungsten copper plate

       Conductive and thermally conductive + arc-resistant, used for electrodes, heat dissipation, and contacts

       III. Specification and Accuracy

       Thickness: 0.1 mm to 50 mm

       Width and length: Customizable according to requirements

       Surface: rolled surface, machined surface, polished surface, mirror polished surface

       Tolerance: Precision level of ±0.01 mm can be achieved